RF and Amplifier PCB Design Considerations

RF and Amplifier PCB Design Considerations

If you want to create an RF and Amplifier PCB, there are several considerations that you must take into account. These include the current path, RF isolation and power distribution.

The materials used in RF and Amplifier PCBs need to have low CTE rates. This is because high frequencies cause a change in the material’s size.


RF circuits require a different material than conventional PCBs to handle the higher frequency signals. This is because they must carry a significant RF and Amplifier PCB amount of current without the resulting signal losses (which can cause crosstalk or skin effect). In addition, high-frequency circuits dissipate a lot of heat, so it is critical to have adequate thermal conductivity in the board.

One of the most important qualities in a RF PCB is the material’s dielectric constant, or Dk. Ideally, it should be constant at all frequencies to avoid signal reflections. It should also be stable with temperature changes to avoid shifts in impedance.

It’s also critical for the RF PCB to have low moisture absorption rates. This is because high-humidity environments can cause shifts in the Dk of the substrate, leading to impedance mismatches and poor amplifier performance. The best RF PCB materials will have moisture absorption rates of less than 2 percent, which is the industry standard for FR-4-based PCB laminates.

Another key feature is the PCB material’s coefficient of thermal expansion, or CTE. A high CTE can lead to a weak spot in the plated hole, which is likely to fail when subjected to repeated flexing. Ideally, the CTE should be low enough to maintain the integrity of the copper layer during etching and assembly. For instance, Rogers’ RO4350B laminate has a CTE of 17 ppm/degC in the x and y directions.


When designing a PCB for RF and amplifier circuits, it is important to use the best materials. These materials have low CTEs, allowing high-speed signals to travel through the circuit with minimal impedance. This minimizes leakage resistances, voltage drifts, and offset voltages. They also have good thermal stability at high temperatures, making them ideal for amplifier circuits.

For the best RF PCB layout, it is important to separate conductive layers for different functions. It is also essential to keep the RF signal away from power and ground planes. This is because these signals can cause interference and crosstalk. In addition, a high-quality RF PCB will have a large ground copper area and avoid using any non-grounded vias within that area.

It is also recommended to use a microstrip layout in the RF section of the PCB. This type of wiring is ideal for RF applications and allows for maximum flexibility in routing. The RF line should be a minimum of 3W wide and separated from the RF and Amplifier PCB Supplier ground planes by at least 1W. It should also be insulated from the copper on the lower layer.

It is also important to use a decoupling capacitor on the BIAS pin. This will prevent unwanted RF interference and increase the sensitivity of the signal. The bypass cap should have a through hole diameter equal to the transmission line width.


RF and amplifier PCBs require components that can accommodate the voltages, currents and time constants associated with these signals. They also need to be impedance matched for maximum signal-to-noise ratio. This requires careful consideration of the traces and their lengths, the placement of capacitors and the use of grounding pads. It is also important to minimize crosstalk, which is the transfer of energy between traces on different layers due to inductive and capacitive couplings.

In addition, RF PCBs must be able to withstand high temperatures. In order to do so, the substrate material used must have a decomposition temperature, which is defined as the lowest temperature at which the material can be mechanically deformed without undergoing significant changes in its composition. In a similar vein, the materials used must be able to resist moisture absorption. This is particularly important for RF boards, which may be exposed to varying humidity conditions.

Finally, it is critical to keep RF transmission lines as far apart as possible and to avoid using parallel routing over long distances. Coupling between transmission lines increases as their distance from each other decreases. The best solution is to use a grounded coplanar waveguide, which offers excellent isolation between lines. Additionally, VCC lines should be routed on a separate layer from sensitive circuits. These should be supplied with adequate bypass capacitors to reduce the effect of varying supply voltage on the system.


RF testing is challenging because of the low signal levels and the need for an environment that emulates end use. To test correctly, the RF part must be mechanically handled and placed in a precision socket with precise contact pressure. A clean socket-to-board-to-tester path is essential, and the RF tester must have good electromagnetic isolation and external noise immunity. In addition, the RF signal line must be routed away from digital signals to avoid coupling.

The RF circuit’s dielectric constant, which measures the material’s ability to store energy in an electric field, can shift as frequency increases. The polarity of the material can also change as it shifts to higher frequencies, which can cause loss and distortion. This can be countered by using a more expensive material with better dielectric properties, but this carries the risk of higher costs.

The thermal coefficient of expansion (CTE) of the PCB can also affect RF performance. A high CTE means that the board can’t handle the stress of drilling holes and soldering. This can cause it to break, resulting in costly delays. A high quality FR-4-based PCB will have a CTE between 2 and 10; however, the CTE can increase when it is drilled or heated during assembly. A good TIM material can mitigate this issue. A TIM with a lower CTE will be less likely to smear at drill, and it can withstand the heat of soldering.

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